SMD and COB, who will become the mainstream of LED tube light source?

The current development of LED tube light, already very mature, popularize laid a good technical basis for the mass market, but the future LED tube light to go more long-term, open the greater consumer market, also need to do a lot of hard work and innovation. Between SMD and COB light source, who will be the mainstream of future canister light application? Moreover, take a look at COB encapsulation mode of LED tube light is so popular, the product reliability so high for several reasons. SMD/COB, who is the tube light source mainstream? Look at the lighting industry's comments on: high-power was started in 2011 in the field of tube light, the patch should be in the second half of 2012 was applied to tube light, COB began to fire the second half of 2013, a year a change, become too fast. Last patch of light source of LED spotlights, COB will be a lot more this year, LED canister light slowly toward high quality COB direction. Patch application has 45 years, but patch tube lamp is flat, saw a plane body, now require anti glare, rather than see a plane body, so the COB certainly is the mainstream in the future. COB light source 2012 application in LED spotlights, tube light now are mainly composed of COB. It is a form of deep cover, has anti glare, brightness and intensity of illumination, etc. In my opinion, in 2010, perhaps everyone will say power products are the mainstream, in 2013, everyone will say the patch is the mainstream, so today, in 2014, when you go to the market investigation, both dealers and consumers, they will all tell you, the mainstream of COB light source is the true. China's lighting industry, said a famous designer. So, COB encapsulation mode of LED tube light is really up to the present and the future the demand of the market, in the look at a few of the reason for the high reliability products. COB encapsulation process only needs in the process of production can be control the quality of the good five welding line, and SMD encapsulation process in addition to the five welding line to control the quality of good, also need to control the lamp glass bead support four leg while crossing the reflow soldering process of welding quality. According to the principle of reliability, a system control link is less, the higher the reliability. Because for SMD package, how to ensure that millions of solder joints is not fake in welding, welding, welding, is a very difficult technology, appear a little problem will affect the quality. So, it is created this revolutionary step COB encapsulation process, get rid of the bracket welding this link table. This is to ensure the highest weights in COB packaging reliability factors. Second, reflow furnace temperature lamp bead failure caused by when a reflow soldering SMD lamp beads parts usually need 240 & deg; Temperature, at high temperatures, lights, devices are likely to occur two kinds of failure could be: a failure is LED chip under the effect of high temperature cracking fragmentation. Another failure is the LED chip welding wire under the action of high temperature tensile failure. And the COB packaging tube light is simply does not exist the problem. Three, better heat dissipation sex COB encapsulation process is directly to bare LED chip is fixed to the welding plate, so the cooling area is relatively traditional encapsulation technology, material the integrated heat transfer coefficient is high also, heat dissipation is better. Four, protective treatment no dead Angle COB encapsulation process lamp pliable half spherical surface curve, light surface all device consists of epoxy resin adhesive coating, no pin bare outside the device. So whether it is used in indoor or outdoor environment or bad wet salt fog environment, will not have the device pin oxidation lamp bead failure caused by fear.
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