To improve the method of high power LED heat dissipation

as towards high power LED, LED fluorescent lamp, commercial ceiling lamps, and A lot of power type LED drive current of 70 mA and 100 mA 1 A, even though current increases can improve the brightness of the LED, power, but it will cause the chip internal heat accumulation, LED to the decrease of the light wavelength drift, the light efficiency and phosphor accelerated aging and shorten the service life and so on A series of problems.

the industry have high power LED heat dissipation problems have made many efforts to: through the chip extensional structure optimization design, using surface coarsening technology such as improving chip internal and external quantum efficiency, reduce generating radiative recombination of lattice vibration, radically reduce heat dissipation component load; By optimizing the encapsulation structure, material, LED bulb lamp, LED absorb dome light, choice is given priority to with aluminum base metal core printed circuit board ( MCPCB) , using the methods of ceramic and composite metal substrate, to speed up the heat from escaping through the epitaxial layer to the heat dissipation base board.

most manufacturers also suggested using a heat sink in high-performance requirements, relying on strong convective cooling methods of promoting high power LED heat dissipation. In spite of this, a single LED products are now also only in tier 1 ~ 10 W, heat dissipation ability still needs to be improved. A considerable amount of research focused on looking for high heat conductivity and packaging materials, heat sink when LED power reached more than 10 W, however, the attention met with considerable resistance. Air-cooled strong convective way even if, at the expense of the cost advantage, also failed to obtain satisfactory change.

discussion in the existing structure, LED encapsulation and heat sink materials thermal conductivity factors such as the impact of changes to its maximum power, LED hutch defends light, LED panel light, to find the key factors that affect the LED heat dissipation. Research methods for finite element thermal analysis. This method has LED the finite element model is verified by the experiments and its difference between the real device, prove in the range of permission error is accurate and feasible.

the cause of the high power commercial ceiling lamps bead burn

1. Up and down two filament, we in the industry is called gold, pure gold, be conductive to use, two positive and two negative, really good product will have the fifth wire, welding on the zener, the protective;

2。 Shorter filament is already very clear tell you, you the lamp has been burned large current, equivalent circuit;

3。 1 w high power drive current about 350 ma, the working voltage in 3. 2 - 3. Between 6 v, please it is important to note that when using large current will be burning lamp;

4。 Typically three 1 w lights aluminum plates are driven around 12 v, there are few direct use 220 v, the less you see is not a constant current source or a less driving power supply of 12 v.

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